MPCVD Diamond Heatspreader Heatsink
| Application | Diamond heat-spreader role |
|---|---|
| GaN HEMT | Reduce channel/junction temperature and thermal hotspots |
| GaN RF power amplifier | Spread high RF power density |
| SiC power devices | Reduce thermal resistance and temperature gradients |
| High-power laser | Remove concentrated optical/laser heat |
| 3D IC / advanced packaging | Provide high-conductivity vertical and lateral thermal paths |
| AI/HPC electronics | Manage localized high heat flux from chiplets and accelerators |
| RF/mmWave/THz electronics | Stabilize device temperature at very high power density |
| Power modules | Replace or augment conventional Cu/AlN thermal spreaders |
