Diasemi DiaCu Diamond and Copper Composite Heat Sink
Thermal conductivity grade: (TC) at 300 K (W m-1 K-1)
DiaCu 1000
DiaCu 800
DiaCu 600
Advantages :
Perfect hybrid of ultra high thermal conductivity and optimized cost
Improves thermal performance of the device package
Increases device reliability
Enhances output power
Maintains performance and structural integrity after thermal cycle testing
TC and CTE can be tuned by varying the copperdiamond composition
Availability
Cu-Diamond can be supplied in sizes ranging from a few mm to several cm, and can be coated with thin metal layers, such as Au and Ni, allowing for compatibility with standard die attach bonding. Complex shapes and features, such as holes, steps and curves, can be produced according to customer requirements. Further details are available upon request
