Home > News > Wafer Chuck Table for Die Separation Process

12-16-2024

Wafer Chuck Table for Die Separation Process

Wafer Chuck Table for Die Separation Process


DISCO DDS2300 etc Die Separator 


The 3 R Benefits of SEMIXICON wafer chuck tables


Realize stable die separation after stealth dicing 

Remove particles contamination easily

Reduce the potiential thermal damage thanks for the better thermal properties of the new designed SEMIXICON chuck tables


DMU`K%($IS~LQTY@ZSO`{OJ.jpg


1L`NP2VPPN`ARF@MBPPWX)Y.jpg


12/16/2024 Fremont ,CA


Copyright © Semixicon LLC All Rights Reserved.