Wafer chuck table recondition, duplication and customized modification

Wafer chuck table recondition, duplication and customized modification

Modification to improve your wafer chuck performance and life time

Regular modification items:

 

Adjustment of porous ceramic zones:

Add or remove 4, 6, 8 inch, increase or decrease porous diameter

 

Add drainage holes, trenches etc to reduce particle gathering and clogging  

 

Hybrid modification between different makes to accommodate certain models on different machines 

 

We can build per customer expectations or troubleshoot the issues and make proposed modifications.

 

Some of the modification works (Model DISCO DAG810 Wafer Grinding Chuck Modification)