Micro Precision Laser Fabrication, TCV,TGV, TSV On Ceramic, Glass, Sapphire, Quartz

Micro Precision Laser Fabrication On Ceramic, Glass, Sapphire, Quartz (TSV, TCV, TGV)

 

Laser (Selective) induced thermal etching deep hole

 

Wafer size: 2 inch, 4 inch, 6 inch, 8 inch, 12 inch

 

Thickness from 30-2000μm

 

Hole size: 5~500μm（特殊尺寸可定制）

 

Aspect ratio: ≤ 20:1

 

Taper angle: 1° to 7°

 

Steepness: ≥88°