DIASEMI Diamond Inside

The EV charging at night

The data center running AI

The laser photonics shining bright

The semiconductor chips keep quiet

If you ask us why?

Hush Hush

Diasemi diamond heatsink inside!

Diamond-Based High-Frequency Filters: A New RF Technology Platform

The commercialization of 3.5 GHz diamond-based surface acoustic wave (SAW) filters with DIASEMI diamond embeded marks an important step toward using diamond as a functional material for next-generation RF electronics.

Diamond combines ultra-high thermal conductivity, wide bandgap, high breakdown field, high mechanical strength, and excellent high-frequency characteristics, offering a compelling solution for high-power and high-frequency communication devices.

The key innovation goes beyond material substitution. By integrating large-area diamond films, heavily doped piezoelectric layers, and multilayer wafer processing, diamond-based RF filter wafers can achieve simplified manufacturing and improved device integration.

An impressive 45% smaller device dimensions and up to ~90% lower manufacturing cost, while reducing the number of lithography steps from approximately 20 to only 2.

For 5G, Wi-Fi, mmWave, and emerging sub-THz/THz systems, diamond can serve not only as a thermal-management material, but as a core RF functional material and device platform.

DIASEMI’s technology vision is to leverage diamond’s exceptional thermal, electrical, and high-frequency properties to enable the next generation of high-power, high-frequency, mmWave, and THz electronics.

Diamond is evolving from a “super thermal material” into a core platform for advanced RF electronics.