SEMIXICON DIASEMI Diamond and Ceramic ,Diamond and Metal Composite Heatsink
Diamond and Metal ;Diamond and Ceramic Composite Heatsinks
Thermal Management Context
With chip heat flux rapidly exceeding the 1–10 kW/cm² regime, traditional W–Cu, Mo–Cu, and polymer TIM systems are nearing intrinsic limits. The core industry bottlenecks include bulk thermal conductivity enhancement, reduction of interfacial thermal resistance, high-temperature reliability, and scalable low-cost manufacturing of advanced heat spreaders.
Diasemi’s Diamond/Metal Composite Advantages
Diamond’s >2000 W/m·K thermal conductivity is unmatched, but monolithic diamond suffers from extreme hardness, low machinability, and severe CTE mismatch with semiconductor materials. Diasemi resolves these constraints via engineered diamond–metal hybridization, achieving composites with:
Thermal conductivity significantly exceeding W–Cu/Mo–Cu through high-volume-fraction diamond networks and optimized percolation pathways.
CTE tunable to 5–10×10⁻⁶/K, enabling direct compatibility with Si, SiC, GaN, and GaAs.
High interfacial bonding strength, derived from diamond surface functionalization and matrix alloy design.
Improved mechanical processability compared with monolithic diamond.
High-Temperature Lamination Challenges
Diasemi’s process addresses the inherent complexity of diamond/metal consolidation:
Complete interstitial elimination requires stringent control of diamond particle morphology and gradated size distribution.
Thermal/pressure field uniformity becomes a dominant defect driver in large-format components.
Interface reactions are highly sensitive to temperature, alloying elements, and surface chemistry.
Cost drivers include diamond powder cost, high-temperature tooling, and final precision machining; batch-scale processing substantially reduces unit cost.
Reliability and Compatibility Metrics
Diasemi composites demonstrate:
<10% degradation after 1000 cycles (–55 °C ↔ 155 °C).
CTE <10×10⁻⁶/K with stable high-temperature modulus.
Low interfacial thermal resistance due to engineered carbide-forming interlayers and high-density consolidation.
Also in Diasemi
Ongoing efforts focus on:
High-κ diamond/Cu and diamond/Al systems for extreme heat flux packaging.
Diamond/SiC ceramic composites for ultra-high thermal stability.
Multiscale interface architecture design and plasma-assisted surface modification.