sp² carbon removal from PCD wafer

sp² carbon removal from PCD wafer

DIASEMI’s advanced PCD surface-cleaning process combines chemical cleaning, H₂ plasma treatment, controlled annealing, and surface functionalization to effectively remove sp² carbon and engineer the desired surface chemistry. The process is designed for ALD, metallization, semiconductor packaging, and advanced diamond electronics, with XPS, Raman, AFM, and contact-angle analysis used for process verification.